COFAN集团：以全新3P封装技术 破解大功率散热难题
摘要： 近日，阿拉丁新闻中心从美国硅谷企业Cofan集团处获悉，其近期推出的1200W的大功率工矿灯，不仅很好地解决了散热问题，而且可使成本降至更低，现已达量产水平。另外Cofan集团在解决散热的问题上带来了他们独到的3P封装技术。记者有幸采访到Cofan集团总裁特别助理Sang Han和集团品牌总监Carol Chiu，共同探讨大功率LED灯的散热问题和中国的市场计划。
散热可谓是大功率LED灯具目前最大的一道技术门槛，各厂家在散热基板、散热模块的设计上也费尽了苦心,但在体积、成本和效果上仍然没有颠覆性的突破。
Heat dissipation can be described as the biggest technical problem in high-power LED COBs at present. Many manufacturers are working hard on substrate radiation methods and radiator module design, but in terms of volume, cost, and performance they have yet to make a breakthrough.
Cofan集团美国总部大楼
近日，阿拉丁新闻中心从美国硅谷企业Cofan集团处获悉，其近期推出的1200W的大功率工矿灯，不仅很好地解决了散热问题，而且可使成本降至更低，现已达量产水平。他们还透露，计划将推出2400W甚至更高功率的产品Cofan集团在解决散热的问题上带来了他们独到的3P封装技术，今天有幸采访到Cofan集团总裁特别助理Sang Han和集团品牌总监Carol Chiu，共同探讨大功率LED灯的散热问题和他们在中国的市场计划。
Recently, however, The Alighting News Center was glad to learn that American company Cofan Group and one of brand family- Flip Chip Opto has launched a 1200W LED COB with not only a perfect solution to the heat problem, but also lowered costs, and has now entered mass production. They also revealed that they are going to launch a 2400W COB and potentially even higher wattage products in the near future.
Cofan’s 3P unique packaging technology in solving the problem of heat dissipation, today have the opportunity to interview the Cofan Group President Special Assistant Mr. Sang Han, and the Brand Director Carol Chiu to discuss the heat dissipation of high-power LED COBs and their Chinese market plan.
Cofan集团总裁特别助理Sang Han
Cofan Group President Special Assistant-Sang Han
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