项目名称： CMH全无机封装技术

CMH Inorganic package technology

申报单位： 广州市鸿利秉一光电科技有限公司

综合介绍或申报理由：

CMH全无机封装技术是广州市鸿利秉一光电科技有限公司开发且有专利保护的一种新型封装技术，即采用陶瓷（Ceramic）、金属（Metal）和硬质玻璃（Hard Glass）等无机材料，通过特种焊接技术将芯片（UV LED/VCSEL等）封装于由全无机材料组成的密闭腔体内。CMH全无机封装技术是国内首创的封装技术，具有可靠性高、效率高和气密性好等技术特点，器件衰减小，能量强度高，容易使用和维护。目前，公司依托于此封装技术已经开发了CMH3535/CMH6868等多系列UV LED产品及VCSEL产品，在客户端具有较好的口碑和影响力。

CMH inorganic package technology is a novel package technology, which developed and patented by Guangzhou BYTECH Electronics CO., LTD. In brief, CMH inorganic package technology is to encapsulate the chip (UV LED/VCSEL…) in a cavity, which consists of inorganic material elements, such as ceramic, metal and hard glass, by a special welding technology. CMH inorganic package technology is originated in China, and it has the advantages of high reliability, high efficiency and good gas tightness. By now, based on CMH inorganic package technology, BYTECH already developed several series of UV LED products such as CMH3535/CMH6868, and got good reputation of customers.

主要技术参数：

下图

与国内外同类产品或同类技术的比较情况：

1、CMH全无机封装技术100%采用无机材料进行封装，同行他家或多或少使用有机材料，避免了有机材料老化失效；

CMH inorganic package technology 100% utilizes inorganic materials to avoid the aging failure of organic materials. In comparison, all of our competitors use organic materials, more or less.

2、相比同行产品，我公司的CMH全无机封装的器件可加载1.1-1.5倍的电流；而且，使用和维护方便，能量高，衰减小，器件一致性好。

Compared with all of competitors, CMH inorganic products can load 1.1-1.5 times of current.

3、耐候性更好，可擦拭。

Better weatherability, and can use ethyl alcohol and non-dust cloth to clean the CMH inorganic products.

经济评价分析：

UVLED市场及应用呈现快速发展的态势，国内外也越来越多的企业抢进这一细分领域。2015－2020年复合成长率（CAGR）达34％，对2018年国内市场调查，我司2018年销售额占国内比例高达10%。 The market and application of UVLED show a rapid development situation, and more and more companies at home and abroad are rushing into this subdivision. The compound growth rate(CAGR) reached 34 % in 2015-2020. In the 2018 survey of the domestic market, our sales in 2018 aced for as much as 10 % of domestic sales.

技术及工艺创新要点：

1、CMH全无机封装技术100%采用无机材料进行封装，避免了无机材料的老化失效；

CMH inorganic package technology 100% utilizes inorganic materials to avoid the aging failure of organic materials.

2、采用了特种焊接技术将芯片封装于由无机材料组成的密闭腔体内，此种封装技术可靠性高、效率高，适合产品量产。

Utilizes a special welding technology to encapsulate the chip in a cavity which consists of inorganic materials. This package technology has high reliability and efficiency, and is suitable for mass production.

实际运用案例和用户评价意见：

如下图

获奖、专利情况：

1、一种LED无机封装用盖板，赵延民，发明专利ZL201310715544.1；

A cover for inorganic LED package, Zhao Yanmin, invention patent NO. ZL201310715544.1;

2、一种LED用陶瓷基板，赵延民，发明专利ZL201310715532.9；

A ceramic substrate for LED, Zhao Yanmin, invention patent NO. ZL201310715532.9;

3、一种LED封装方法，汤乐明，发明专利ZL201310220803.3；

A package method for LED,Tang Leming, invention patent NO. ZL201310220803.3;

4、一种LED及其封装方法，赵延民，发明专利ZL201310220818.X；

A LED and its package method, Zhao Yanmin, invention patent NO. ZL201310220818.X.

申报单位介绍：

广州市鸿利秉一光电科技有限公司是鸿利智汇集团股份有限公司（股票代码：SZ300219）下属专业从事UV LED封装及其应用解决方案的子公司，是国家高新技术企业，公司是国内首家推出全无机气密性封装UV LED，依托CMH（陶瓷、金属、玻璃）技术平台，致力于研发和生产高效、稳定的UV LED封装产品。公司处2013年12月成立至今，已经申请专利13项发明专利，其中7项已授权，目前产品在胶印、丝网印刷、柔性印刷、凹板印刷、喷绘、UV曝光、杀菌消毒、空气净化、3D打印等行业广泛使用。

Guangzhou Bytech Electronics Co.Ltd.is a subsidiary of Hongli Group whospecialize in UV LEDpakage and provide UV application solution.It is a national high-tech enterprise. Bytech is the first company in China to lunch full inorganic pakage UV LED which is based on CMH(Ceramic,Metal,hard glass)technology platfrom,and is committed to research and manufacture high quality and reliable UV LED.We has applied for 13 patents ， inculding 7 authorized patents.At present,Our company UV LED product have been applied for flexible printing,offset printing screen printing,ink-jet printing,intaglio printing,UV exposure,air purification,sterilization,3D printing and other industries widely.

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