| |
LPD2218A4ACS | |
Package Type : |
Array Package |
Main Substrate Material : |
Al2O3 96% |
Thermal Conductivity : |
22~24W/m·K |
Coefficient of Thermal Expansion : |
6.4~6.8ppm/℃ |
Mechanical Strength : |
350~400MPa |
Panel Size : |
150×50×1.05㎜3 |
Panel Array : |
8×2=16pcs |
Unit Size : |
22×18×1.05㎜3 |
Final Surface Plating : |
Silver |
Singulation Type : |
Breaking (Laser V-cut) |