项目名称： 一种线路板的新型隔热结构

Novel Heat Insulation Structure Of Circuit Board

申报单位： 深圳市领德辉科技有限公司

综合介绍或申报理由：

本实用新型的线路板的新型隔热结构，通过连接柱与通孔以及焊盘配合实现防护板与主板体的固定，隔热板和防护板都具有隔热作用，防护板上的支撑柱阵列具有支撑作用，还具有易于通风的作用，因此这种隔热结构具有隔热效果好的优点，防护板还能有效防止主板体变形，因此，这种线路板的新型隔热结构具有良好的防护性能。

The novel heat insulation structure of the circuit board of the utility model realizes the fixation of the protection board and the main board body through the cooperation of the connection post with the through hole and the pad. It has a supporting effect and also has the function of easy ventilation. Therefore, this thermal insulation structure has the advantage of good thermal insulation effect. The protective plate can also effectively prevent the deformation of the main board body. Therefore, the new thermal insulation structure of this circuit board has good protection .

主要技术参数：

本实用新型涉及一种线路板的新型隔热结构，产品特点：

a、绝缘层薄，热阻小

b、无磁性

c、散热好

d、机械强度高

产品标准厚度：0.8、1.0、1.2、1.5、2.0、2.5、3.0mm

铜箔厚度：1.8um 35um 70um 105um 140um

The utility model relates to a novel thermal insulation structure of a circuit board.

Features:

a.Thin insulation layer and low thermal resistance

b.Non-magnetic

c.Good heat dissipation

d.High mechanical strength

Product standard thickness：0.8、1.0、1.2、1.5、2.0、2.5、3.0mm

Copper foil thickness:18um 35um 70um 105um 140um

技术及工艺创新要点：

一种线路板的新型隔热结构，包括主板体和背板的支撑板，主板体和背板的支撑板之间设有隔离层，支撑板上设有多根垂直于支撑板板面的连接柱，隔离板和主板体上均设有多个与所述连接柱位置相对应的通孔，通孔的外端部设有焊盘，多个连接柱对应从多个通孔中穿出并显露出外端部，连接柱的外端部与焊盘焊连。主板体.隔离板.支撑板均为方形板体。

A novel heat-insulating structure for a circuit board includes a main board body and a support plate for the back plate. An isolation layer is provided between the main board body and the support plate for the back plate. The support plate is provided with a plurality of connecting posts perpendicular to the surface of the support plate. A plurality of through holes corresponding to the positions of the connecting pillars are provided on the isolation board and the main board body. Pads are provided at the outer ends of the through holes, and the multiple connecting pillars are correspondingly penetrated the multiple through holes and exposed. Out of the outer end, the outer end of the connection post is soldered to the pad. The main board body, the isolation plate and the support plate are all square plate bodies.

获奖、专利情况：

申报单位介绍：

领德辉立足于线路板、铝基板及FPC的制造，兼具优质、低价和快速的铝基板和FPC制作配合等优势，旨在为业界提供高性能、低成本的PCB线路板及配套解决方案。公司已全套引进国际标准的全自动生产设备，配备整套先进的检测设备，并全面贯彻执行ISO质量管理体系。

产品图片：